(PowerKorea) Samsung Electronics has developed I-Cube4. It is an independent structured heterogeneous integration packaging technology that realized the high bandwidth memory chip into one single package. I-Cube4 is expected to be used for high performance computing, AI and cloud services, and data centers. I-Cube4 is loaded with Si-Interposer to realize ultra-fine wiring, stable power supply and efficient heat release technologies. The South Korean electronics giant released I-Cube2 in 2018 and X-Cube in 2020. 

Kim elected as chairman of 3GPP

Samsung Research Next Generation Communications Research Center master Kim Yoon-sun has been elected as the chairman of the 3GPP of RAN WG1(Radio Access Network Working Group1. It is the first time that a Korean was elected as the chairman. 3GPP (3rd Generation Partnership Project) is the largest international mobile communication technology standard organization and 600 people are working in the biggest division RAN WG1. Kim has engaged in communication standard for 20 years and served as the Samsung representative of the 3GPP RAN WG1. She worked as the deputy chairman of RAN WG1 from 2017. As of May 2021, Samsung Electronics has 2 chairmen and 3 vice chairmen in 15 divisions of the 3GPP that has 700 member companies. 

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